- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Patent holdings for IPC class H01L 21/301
Total number of patents in this class: 1819
10-year publication summary
103
|
80
|
116
|
84
|
132
|
167
|
126
|
123
|
126
|
52
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Lintec Corporation | 1915 |
352 |
Hamamatsu Photonics K.K. | 4161 |
164 |
Nitto Denko Corporation | 7879 |
112 |
The Furukawa Electric Co., Ltd. | 3486 |
109 |
Hitachi Chemical Company, Ltd. | 2455 |
65 |
Applied Materials, Inc. | 16587 |
57 |
Tokyo Seimitsu Co., Ltd. | 257 |
42 |
Towa Corporation | 236 |
39 |
Tokyo Electron Limited | 11599 |
35 |
Disco Corporation | 1745 |
35 |
Resonac Corporation | 2233 |
35 |
Mitsui Chemicals Tohcello, Inc. | 252 |
34 |
Showa Denko Materials Co., Ltd. | 629 |
29 |
Mitsuboshi Diamond Industrial Co., Ltd. | 145 |
28 |
Denki Kagaku Kogyo Kabushiki Kaisha | 680 |
26 |
Sumitomo Bakelite Co., Ltd. | 1416 |
22 |
Mitsubishi Electric Corporation | 43934 |
21 |
Rohm Co., Ltd. | 5843 |
19 |
Yamaha Hatsudoki Kabushiki Kaisha | 1998 |
19 |
Denka Company Limited | 2189 |
17 |
Other owners | 559 |